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Datasheets Samsung Electronic

Part name
Description
Manufacturer
Package
Pins
Temp. Range
PDF datasheet
K4R271869B-NCG6256K x 18 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz.Samsung ElectronicmicroBGA(normal CSP)540°C | 100°CK4R271869B-NCG6 datasheet (306K)
K4R271869B-NCK7256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz.Samsung ElectronicmicroBGA(normal CSP)540°C | 100°CK4R271869B-NCK7 datasheet (306K)
K4R271869B-NCK8256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz.Samsung ElectronicmicroBGA(mirrored CS540°C | 100°CK4R271869B-NCK8 datasheet (306K)
K4R441869AM-CG6256K x 18 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz.Samsung ElectronicmicroBGA(mirrored CS620°C | 70°CK4R441869AM-CG6 datasheet (3M)
K4R441869AM-CK7256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz.Samsung ElectronicmicroBGA(mirrored CS620°C | 70°CK4R441869AM-CK7 datasheet (3M)
K4R441869AM-CK8256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz.Samsung ElectronicmicroBGA(mirrored CS620°C | 70°CK4R441869AM-CK8 datasheet (3M)
K4R441869AN-CG6256K x 18 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq. 600 MHz.Samsung ElectronicmicroBGA(normal CSP)620°C | 70°CK4R441869AN-CG6 datasheet (3M)
K4R441869AN-CK7256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 711 MHz.Samsung ElectronicmicroBGA(normal CSP)620°C | 70°CK4R441869AN-CK7 datasheet (3M)
K4R441869AN-CK8256K x 18 x 32s dependent banks direct RDRAM. Access time: 45 ns, I/O freq. 800 MHz.Samsung ElectronicmicroBGA(normal CSP)620°C | 70°CK4R441869AN-CK8 datasheet (3M)
K4R881869M-NCG6512K x 18 x 32s dependent banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz.Samsung ElectronicmicroBGA(normal CSP)560°C | 100°CK4R881869M-NCG6 datasheet (3M)