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5962L9960704TXA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)UTMCFlatpack shielded36-40°C | 125°C5962L9960704TXA datasheet (127K)
5962L9960704TXC512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si)UTMCFlatpack shielded36-40°C | 125°C5962L9960704TXC datasheet (127K)
5962L9960704TXC512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si)UTMCFlatpack shielded36-40°C | 125°C5962L9960704TXC datasheet (127K)
5962L9960704TXX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si)UTMCFlatpack shielded36-40°C | 125°C5962L9960704TXX datasheet (127K)
5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).UTMCCeramic flatpack36-55°C | 125°C5962P0053601QUA datasheet (128K)
5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).UTMCCeramic flatpack36-55°C | 125°C5962P0053601QUA datasheet (128K)
5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).UTMCCeramic flatpack36-55°C | 125°C5962P0053601QUA datasheet (128K)
5962P0053601QUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).UTMCCeramic flatpack36-55°C | 125°C5962P0053601QUC datasheet (128K)
5962P0053601QUX512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).UTMCCeramic flatpack36-55°C | 125°C5962P0053601QUX datasheet (128K)
5962P0053601QUX512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).UTMCCeramic flatpack36-55°C | 125°C5962P0053601QUX datasheet (128K)