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5962D0053604TXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).UTMCFlatpack shielded36-40°C | 125°C5962D0053604TXC datasheet (128K)
5962D0053604TXX512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).UTMCFlatpack shielded36-40°C | 125°C5962D0053604TXX datasheet (128K)
5962D0151101QXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 1E4(10krad(Si)).UTMCCQFP68-40°C | 125°C5962D0151101QXC datasheet (135K)
5962D0151101TXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 1E4(10krad(Si)).UTMCCQFP68-40°C | 125°C5962D0151101TXC datasheet (135K)
5962D0153201QYC1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)).UTMCCFP44-40°C | 125°C5962D0153201QYC datasheet (95K)
5962D0153201QYC1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)).UTMCCFP44-40°C | 125°C5962D0153201QYC datasheet (95K)
5962D0153201TYA1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).UTMCCFP44-40°C | 125°C5962D0153201TYA datasheet (95K)
5962D0153201TYX1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).UTMCCFP44-40°C | 125°C5962D0153201TYX datasheet (95K)
5962D9960601QUA512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).UTMCCeramic flatpack32-55°C | 125°C5962D9960601QUA datasheet (107K)
5962D9960601QUC512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)).UTMCCeramic flatpack32-55°C | 125°C5962D9960601QUC datasheet (107K)